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Full-field Strain Measurements of A Novel Lead-free Solder Based on Digital Image Correlation

For electronic packaging, nowadays, numerous investigations have so far been dedicated to the determination of solder joint's mechanical properties such as their creep response under thermo-mechanical loading. There are a broad variety of experimental devices and techniques that researchers have employed for the studying of different types of solders. Indeed, conventional techniques used for characterization include tensile and compressive tests, nano-indentation, acoustic wave propagation, among others.

Từ khóa: InnoLot, lead-free solder, DIC, full-field strain measurement

9 p ovanketv 07/06/2019 292 2

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