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MEMS/MOEMS packaging: Concepts, designs, materials, and processes

MEMS/MOEMS packaging: Concepts, designs, materials, and processes/ Ken Gilleo. -- New York: McGraw-Hill, 2005
xiii, 220p.; 24cm
ISBN 0 07 145556 6

1. Microelectronic packaging. 2. Optoelectronic devices. 3. Microelectromechanical systems.

Dewey Class no. : 621.381 046 -- dc 22
Call no. : 621.381046 G476




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