Tài liệu Thư viện số

Danh mục TaiLieu.VN

Electronic assembly fabrication : Chips, Circuit Boards, Packages, and Components

Electronic assembly fabrication : Chips, Circuit Boards, Packages, and Components/%c Charles A. Harper. -- 1st ed. -- NY: McGraw Hill, 2002
xv, 671p.; 24cm
ISBN 0071378820

1. Electronic packaging and interconnection series.

Dewey Class no. : 621.3821 -- dc 22
Call no. : 621.3821 H236




Dữ liệu xếp giá
SKN004872 (DHSPKT -- KD -- )

Từ khóa: Wireless communication systems, Wireless LANs

9 p minhhoai 07/10/2013 444 1

Bình luận